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2 posts tagged with "MTT S5000"

摩尔线程 MTT S5000 全功能 GPU

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Domestic GPU IPO Wave: The "Four Little Dragons" Assemble on Capital Markets, Moore Threads MTT S5000 Benchmarks Against H100

· 5 min read
Industry Research Team

From December 2025 to July 2026 — just half a year — at least 6 AI chip companies have listed or are about to list on capital markets. Together with already-listed Cambricon, Hygon, and Iluvatar, the domestic GPU corps' total market cap is approaching ¥2 trillion. This marks the critical climb from domestic GPUs being "usable" to "useful."

1. The "Four Little Dragons" assemble on capital markets

CompanyListing statusRaise / issue priceSponsor
Moore ThreadsListed (STAR Market sh688795, 2025-12-05)Issue price ¥114.28, raised ¥8BCITIC Securities
MetaXIPO accepted (2026-06-30)¥3.904B (total investment ¥5B)Huatai United
EnflamePassed review (2026-06-15)¥6B
BirenHKEX / sprinting

Already-listed camp: Cambricon (sh688256, STAR Market 2020-07-20), Hygon, Iluvatar (HKEX). Moore Threads turned a book profit of ¥29.35M in Q1; MetaX narrowed losses 57.7% and gave a 2026 breakeven timeline.

2. Moore Threads MTT S5000: benchmarking against H100

Moore Threads announced its flagship AI train+inference GPU MTT S5000 successfully completed full-pipeline adaptation validation of Zhipu's new-generation large model GLM-5 — measured performance "breaks the domestic compute ceiling":

MetricMTT S5000
Architecture4th-gen "Pinghu" architecture
FP8 compute1 PFLOPS (1,000 TFLOPS)
Memory bandwidth1.6 TB/s
PositioningFull-function train+inference GPU, benchmarks against NVIDIA H100
ProductionMass-produced; clusters online supporting trillion-parameter training

Deployment validation: jointly completed full-pipeline training of embodied-brain model RoboBrain 2.5 with BAAI; partnered with SiliconFlow for high-performance DeepSeek-V3 inference, single-card speed near international top products. IPO funds go to three directions: next-gen AI train+inference chip, next-gen graphics chip, next-gen AI SoC chip.

WAIC 2026 new progress: Moore Threads showcased the MTT C256 SuperNode (first-of-its-kind single-layer Scale-up 256-card full interconnect, sub-microsecond latency) and three AI-factory solutions — "model training factory / token production factory / agent production factory"; the company pre-announced H1 2026 revenue of ¥1.65B-1.75B, up 135%-149% YoY.

3. Cambricon: dual flagships MLU590/690

ChipProcessComputeMemoryCustomer / status
MLU590 (思元590)7nm ChipletINT8 512 TOPS / FP16 345 TFLOPS96 GB HBM2eByteDance inference mainstay, ~80% of A100 overall, mass shipments early 2026
MLU690 (思元690)5nm-class (SMIC N+2)FP16 700+ TFLOPS / INT8 2800+ TOPS196 GB HBM3 (3.35 TB/s)Dual-die packaging, MLU-Link 890 Gbps; ~70% of H100 (80-90% pure inference); ByteDance largest customer, mass production early 2026

Cambricon is the only domestic AI chip vendor with a "unified edge-cloud architecture" — one MLU instruction set spans 思元 220 (edge) → 370 (border) → 590/690 (cloud), with one NeuWare toolchain across compute tiers.

Capital and performance double explosion: Cambricon's total market cap exceeded ¥1 trillion on June 30, 2026, becoming the STAR Market's first "trillion-yuan stock," up 75%+ YTD. On performance, Q1 2026 revenue ¥2.885B (+160% YoY), deducted net profit ¥934M; full-year 2025 revenue ¥6.497B (+453% YoY), net profit attributable to parent ¥2.059B, ending long-term losses. ByteDance has cumulatively deployed over 100k 思元 590/690, its largest customer.

4. DeepSeek-V4 effect: changing the expectation coordinate system

On April 24, 2026, DeepSeek released the trillion-parameter flagship DeepSeek-V4. Unlike a year earlier when V3's launch sparked debate over "can domestic chips even run large models," this time multiple domestic chips — Huawei Ascend, Cambricon, Hygon, MetaX, Moore Threads, Kunlun, T-Head, Iluvatar — completed adaptation on launch day.

The evaluation coordinate system is shifting: from "what percentage of NVIDIA's same-generation product performance" to "can it carry the real workloads of top-tier large models."

Industry interpretation

  1. Capital ammunition in place: dense IPOs provide ample funding for domestic GPU R&D iteration and capacity expansion, moving from "technology breakthrough" to "commercial virtuous cycle."
  2. Train+inference becomes the mainstream route: Moore Threads takes the full-function GPU route (graphics+AI+general compute), differentiating from Huawei Ascend's "AI-focused."
  3. Software ecosystem is the decider: Day-0 adaptation and the maturity of unified software stacks (MUSA / NeuWare / MXMACA) are replacing raw peak compute as the core yardstick of domestic GPU "usability."

References


This article continuously tracks the domestic GPU listing process and product iteration.

China's Domestic AI Chip Triopoly (2026): Ascend, Cambricon, Moore Threads — Who Is the "China H100"?

· 7 min read
AI Hardware Analyst

Against the backdrop of U.S. export controls, China's AI chip market is forming a "three-way standoff." This article compares the technical routes, product specs, software ecosystems, and commercial progress of the three major domestic AI chip vendors: Huawei Ascend, Cambricon MLU, and Moore Threads MTT.


Key Points

  • Huawei Ascend: leader in domestic AI training chips; Ascend 950 in mass production; most mature software ecosystem
  • Cambricon MLU690: the "China H100," compute close to H200, clear efficiency advantage
  • Moore Threads MTT S5000: full-function GPU route; achieved Day-0 support for Qwen3.5 and GLM-5.2 in June 2026
  • Shared challenge: affected by U.S. export controls, primarily aimed at the Chinese market, limited internationally

I. Vendor Overview

VendorFoundedFounderListed2025 RevenueMain Customers
Huawei Ascend2018 (division)Ren Zhengfeiprivate (wholly owned by Huawei)~¥20B (est.)Chinese gov, SOEs, military
Cambricon2016Chen Tianshi (CAS)2020-07 (STAR Market 688256)~¥5.2BByteDance, Alibaba, Baidu
Moore Threads2020Zhang Jianzhong (ex-NVIDIA China)2023-12 (STAR Market 688495)~¥1.5B (est.)gov, SOEs, gaming cos.

Strategic Positioning

VendorTech routeCore strengthMain challenge
Huawei AscendAI-training-specific (Da Vinci)co-optimized HW/SW, carrier channelssanctions, process limits
CambriconAI-training-specific (MLUarch)high efficiency, competitive priceimmature ecosystem
Moore ThreadsFull-function GPU (MUSA)graphics + AI + general compute, Day-0 supportcompute below dedicated AI chips

II. Flagship Product Comparison

1. Huawei Ascend 950DT (2026 flagship)

ItemSpec
BF16 compute1,000 TFLOPS
Memory144GB HiZQ 2.0 (in-house HBM)
Memory bandwidth4 TB/s
TDP400W
ProcessN+2 (improved 7nm)
Released2026-04
Mass production2026-Q2
Unit price~¥80,000 (est.)

Strengths:

  • High large-model inference throughput: 144GB memory friendly to DeepSeek R1 (671B MoE)
  • Most mature ecosystem: CANN ~85% operator coverage, supports PyTorch, TensorFlow
  • Strong carrier channel: China Mobile, China Telecom large purchases

Weaknesses:

  • Process limited: N+2 below TSMC 4nm
  • Mediocre efficiency: 400W TDP, 2.5 TFLOPS/W

2. Cambricon MLU690 (2026 flagship)

ItemSpec
BF16 compute600 TFLOPS
Memory64GB HBM3
Memory bandwidth2 TB/s
TDP280W
ProcessTSMC 7nm
Released2025-Q4
Mass production2026-Q1
Unit price~¥140,000 (est.)

Strengths:

  • Best efficiency: 280W TDP, 2.14 TFLOPS/W (1.5x H100)
  • Competitive price: ~$20,000, 33% cheaper than H100
  • Top-tier customer orders: ByteDance, Alibaba, Baidu

Weaknesses:

  • Small memory: 64GB limits large-model training scale
  • Immature ecosystem: NeuWare ~75–85% coverage; complex LLMs need manual tuning

3. Moore Threads MTT S5000 (2025 flagship)

ItemSpec
FP16 compute~1,000 TFLOPS (est.)
Memory80GB GDDR6X
Memory bandwidth1.6 TB/s
TDP~350W
ProcessTSMC 4nm (est.)
Released2025-02
Mass production2025-Q2
Unit price~¥50,000 (est.)

Strengths:

  • Full-function GPU: graphics + AI + general compute, broader scenarios
  • Strong Day-0 support: June 2026 Day-0 support for Qwen3.5, GLM-5.2, MiniMax M3
  • Lowest price: ~¥50,000, high cost-performance

Weaknesses:

  • Compute below dedicated AI chips: FP16 ~50% of H100
  • Low memory bandwidth: 1.6 TB/s (48% of H100), limits large-model training

III. Compute Comparison (BF16/FP16)

ChipBF16 computeMemoryBandwidthTDPEfficiency
Huawei Ascend 950DT1,000 TFLOPS144GB4 TB/s400W2.5 TFLOPS/W
Cambricon MLU690600 TFLOPS64GB2 TB/s280W2.14 TFLOPS/W
Moore Threads MTT S5000~1,000 TFLOPS80GB1.6 TB/s~350W~2.86 TFLOPS/W
NVIDIA H100989 TFLOPS80GB3.35 TB/s700W1.41 TFLOPS/W
NVIDIA H200989 TFLOPS141GB4.8 TB/s700W1.41 TFLOPS/W

Key insights:

  1. Ascend 950DT has the highest compute (1,000 TFLOPS) but mediocre efficiency
  2. Cambricon MLU690 has the best efficiency (2.14 TFLOPS/W), TDP only 280W
  3. Moore Threads MTT S5000 wins on full-function versatility but low bandwidth

IV. Software Ecosystem

VendorStackFramework supportCoverageMaturity
Huawei AscendCANNPyTorch, TensorFlow, MindSpore~85%⭐⭐⭐⭐ (4/5)
CambriconNeuWarePyTorch-Cambricon, TensorFlow-Cambricon~75–85%⭐⭐⭐ (3/5)
Moore ThreadsMUSIFYPyTorch, TensorFlow, ONNX~70%⭐⭐⭐ (3/5)
NVIDIACUDAall~99%⭐⭐⭐⭐⭐ (5/5)

Ecosystem Maturity Assessment

Huawei Ascend CANN:

  • ✅ Strength: highest operator coverage, supports MindSpore (in-house framework)
  • ❌ Weakness: steep learning curve, incomplete docs

Cambricon NeuWare:

  • ✅ Strength: PyTorch/TensorFlow compatible, low migration cost
  • ❌ Weakness: complex LLMs need manual tuning

Moore Threads MUSIFY:

  • ✅ Strength: strong Day-0 support, ONNX support
  • ❌ Weakness: lowest operator coverage, dual graphics+AI engine complexity

V. Commercial Progress

Vendor2026 commercial progressMain customersShipments
Huawei AscendAscend 950 mass production; China Mobile large purchaseChina Mobile, China Telecom, gov~100K/yr (est.)
CambriconMLU690 mass production; ByteDance, Alibaba ordersByteDance, Alibaba, Baidu~50K/yr (est.)
Moore ThreadsMTT S5000 mass production; Day-0 Qwen3.5gov, SOEs, gaming cos.~30K/yr (est.)

Latest as of June 2026

Huawei Ascend:

  • ✅ Ascend 950DT fully ramping
  • ✅ ¥1B procurement agreement with China Mobile

Cambricon:

  • ✅ MLU690 in volume shipment
  • ✅ ByteDance order ~20K units

Moore Threads:

  • ✅ Day-0 support for Qwen3.5, GLM-5.2, MiniMax M3
  • ✅ MTT S5000 2nd-gen released

VI. Selection Advice

Scenario 1: Trillion-parameter training (GPT-4 class)

Recommended: Huawei Ascend 950DT

  • ✅ 144GB large memory supports super-large models
  • ✅ Most mature ecosystem (~85% coverage)
  • ✅ Strong carrier channel, Chinese government backing

Alternative: Cambricon MLU690 (high efficiency, but small memory)

Scenario 2: Tens-to-hundreds-of-billions parameter training

Recommended: Cambricon MLU690

  • ✅ Best efficiency (2.14 TFLOPS/W), low TCO
  • ✅ Competitive price (~$20,000)
  • ✅ Validated by top customers (ByteDance, Alibaba)

Alternative: Huawei Ascend 920 (more compute, mediocre efficiency)

Scenario 3: Cloud AI inference

Recommended: Huawei Ascend 950PR (inference-specific)

  • ✅ Well-optimized inference throughput
  • ✅ 128GB memory friendly to MoE models
  • ✅ Mature stack, low deployment cost

Alternative: Moore Threads MTT S5000 (full-function GPU, inference + graphics)

Scenario 4: Edge AI / on-device inference

Recommended: Moore Threads MTT S5000

  • ✅ Full-function GPU, graphics + AI
  • ✅ Lowest price (~¥50,000)
  • ✅ Strong Day-0 support

Alternative: Huawei Ascend 310 (low power, 8W TDP)

Scenario 5: Domestic substitution (gov, SOEs)

Recommended: Huawei Ascend 950DT

  • ✅ Chinese government first choice, carrier bulk buys
  • ✅ Co-optimized HW/SW, stable performance
  • ✅ Supported by national semiconductor fund

Alternative: Cambricon MLU690 (high efficiency, competitive price)


VII. Future Roadmap

Vendor2026 H220272028
Huawei Ascend950DT ramp960 (FP8 ~2 PFLOPS)970 (N+3 process)
CambriconMLU690 rampMLU790 (5nm, BF16 ~1,000 TFLOPS)MLU890 (3nm)
Moore ThreadsMTT S5000 2nd-genMTT S6000 (HBM3, FP16 ~1,500 TFLOPS)MTT S7000

VIII. Summary: Who Is the "China H100"?

DimensionAscend 950DTMLU690MTT S5000
Compute⭐⭐⭐⭐⭐ (5/5)⭐⭐⭐ (3/5)⭐⭐⭐ (3/5)
Memory⭐⭐⭐⭐⭐ (5/5)⭐⭐ (2/5)⭐⭐⭐ (3/5)
Efficiency⭐⭐⭐ (3/5)⭐⭐⭐⭐⭐ (5/5)⭐⭐⭐⭐ (4/5)
Ecosystem⭐⭐⭐⭐ (4/5)⭐⭐⭐ (3/5)⭐⭐⭐ (3/5)
Price⭐⭐⭐ (3/5)⭐⭐⭐⭐ (4/5)⭐⭐⭐⭐⭐ (5/5)
Overall⭐⭐⭐⭐ (4/5)⭐⭐⭐ (3/5)⭐⭐⭐ (3/5)

Final conclusion:

  • Huawei Ascend 950DT is the domestic AI training chip closest to H100, strongest overall
  • Cambricon MLU690 is the most efficient domestic AI chip, lowest TCO
  • Moore Threads MTT S5000 is the cheapest full-function GPU, suited to edge AI and graphics+AI

References


Disclaimer: Data based on public sources; actual specs per vendor official. MirrorFrog continuously updates domestic AI chip data — corrections welcome.

Changelog: 2026-06-23 initial release